To provide an adhesive composition which has good adhesion to a base material such as LCP and is also excellent in low dielectric characteristics.SOLUTION: An adhesive composition is provided that contains a bismaleimide resin (A) represented by the following general formula (1), an epoxy resin (B), an active ester-based curing agent (C) and a curing accelerator (D), the component (D) contains at least one selected from the group consisting of an imidazole-based compound, an amine-based compound and a peroxide-based compound. In formula (1), R1 represents a divalent hydrocarbon group derived from a dimer acid; Q represents a substituted or unsubstituted aliphatic group having 1-100 carbon atoms, a substituted or unsubstituted aromatic group or a substituted or unsubstituted hetero aromatic group; and n represents an integer of 0-100.SELECTED DRAWING: None

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