To provide a method for manufacturing a printed wiring board, which does not lower a yield even in the case where the printed wiring board has an insulating layer formed by multi-stage lamination.SOLUTION: The method for manufacturing the printed wiring board includes: a step of laminating a first resin sheet 1 that contains a first support 2 and a first resin composition layer 3 which is provided on the first support, onto an inner layer substrate 10 so that the first resin composition layer 3 bonds to the inner layer substrate; a step of forming an insulating layer by thermally curing the first resin composition layer; a step of removing the first support; and a step of laminating a second resin sheet that contains a second support and a second resin composition layer which is provided on the second support, onto the insulating layer so that the second resin composition...

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