To provide a resin composition capable of giving a cured product having a low dielectric loss tangent, excellent smear removability, and excellent adhesion to a conductor layer.SOLUTION: The resin composition contains (A) an epoxy resin, (B) a resin having a radically polymerizable unsaturated group, and (C) an epoxy resin curing agent. The component (A) contains (A-1) a glycidylamine type epoxy resin. When the content of the component (A) excluding the component (A-1) is 100 pts.mass, the content of the component (A-1) is 2-250 pts.mass. When the content of the component (B) is 100 pts.mass, the content of the component (A-1) is 3-250 pts.mass.SELECTED DRAWING: None

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