PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board, which enables the increase in adhesion of a dry film even with a low dissipation factor.SOLUTION: A method for manufacturing a printed wiring board comprises: (A) a lamination step for laminating an adhesive film having a support body and a resin composition layer so that the resin composition layer of the adhesive film is put in contact with one or each face of an internal layer substrate; (B) an insulator layer formation step for thermally hardening the resin composition layer to form an insulator layer of 0.005 or less in dissipation factor; (C) a peeling step for peeling the support body; and (D) a roughening step for performing a roughening treatment so that the arithmetic mean roughness Raof a surface of the insulator layer becomes 200-800 nm. In (A) the lamination step, the face of the...

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