To provide a photosensitive composition which can achieve high resolution and excellent curability while having high transparency.SOLUTION: A photosensitive composition contains a photosensitive resin (A), a photopolymerization initiator (B) and a photopolymerizable compound (C). The photosensitive resin (A) contains a photosensitive resin (A1) which is produced by reaction of a product produced by reaction of an epoxy compound (a1) having at least two epoxy groups and carboxylic acid (a2) having an ethylenically unsaturated group, and acid anhydride (a3) containing acid dianhydride (a4). When a dry film having a thickness dimension of 10 micro m is prepared from the photosensitive composition, light transmittance at a wavelength of 450-800 nm is 85 percent or more, a maximum value of absorbance in a wavelength region of 250-800 nm of the dry film is in a wavelength region of 300-330 nm, and a maximum value of the absorbance is 1 or larger.SELECTED DRAWING: Figure...

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