A polymer compound, a resin composition, a resin film, and a method for manufacturing the same, the polymer compound having excellent low dielectric constant, solvent solubility, and heat resistance, Provided are a prepreg, a laminate, a printed circuit board, and a semiconductor package. A polymer compound comprising a repeating unit represented by the following general formula (1). (In the general formula (1), X is a divalent organic group. The dashed line is a bond.) TIFF2024012085000075.tif50169 Fig. 1

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