A cover tape comprising a base material layer, an intermediate layer, and a sealant layer in this order, wherein even if a biomass-derived polyethylene-based resin is used for the intermediate layer, The cover tape can be heat-sealed to the carrier tape with sufficient strength at a relatively low temperature. A laminate comprising a substrate layer, a first intermediate layer, a second intermediate layer, and a sealant layer in this order, Cover tape for packaging electronic components. In the cover tape, the first intermediate layer comprises a biomass-derived polyethylene-based resin, and the second intermediate layer comprises a polyethylene-based resin having a density of 0.908 grms per Cucic Centimeter or less. Figure 1

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