Provided are a method for manufacturing a metal foil with a resin, which can sufficiently reduce a warpage amount and can maintain the warpage amount small even after storage, and a method for manufacturing a laminate, a printed wiring board, and a semiconductor package using the metal foil. A method for manufacturing a metal foil with resin 10 having a metal foil 1 and a resin layer 2 formed on one surface side of the metal foil using a thermosetting resin composition, the method comprising a warpage correction process for reducing warpage of the metal foil with resin, Pressing a warpage correction tool 6 against the metal foil side surface of the metal foil with the resin, conveying the metal foil with the resin in a state where the warpage correction tool is pushed into the resin layer side, and passing it over the warpage correction tool to continuously bend...

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