Provided is a cover tape for packaging an electronic component, in which blocking is suppressed and sticking of a component is suppressed. A cover tape for packaging an electronic component, comprising: A base material layer; and a sealant layer provided on one side of the base material layer. In the cover tape, a surface of the sealant layer opposite to the substrate layer side is an exposed surface. The peak density SPD of the exposed surface of the substrate defined in ISO 25178 is 3x105 JiH106/mm 2, and the root mean square slope SDQ of the exposed surface defined in ISO 25178 is 1.0x10 -2 5.0 x 10 -1. Figure 1

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