Provided is a cover tape for packaging an electronic component, in which blocking is suppressed and sticking of a component is suppressed. A cover tape for packaging an electronic component, comprising: A base material layer; and a sealant layer provided on one side of the base material layer. In the cover tape, a surface of the sealant layer opposite to the substrate layer side is an exposed surface. The peak density Std of the peaks defined in ISO 25178 of the exposed surface is 3x105 and 1x106/mm 2, and the expanded area ratio SDR of the interface defined in ISO 25178 of the exposed surface is 1x10 -3 and 5x10 -2. Figure 1

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