The objective of the present disclosure is to provide an adhesive resin sheet that shows an excellent loss tangent in high frequency bands (10 GHz, 20 GHz, 40 GHz) and exhibits high migration resistance and excellent bendability after a solder reflow step. The problem is solved by the provision of an adhesive resin sheet that satisfies the following i to iv when the adhesive resin sheet is heated at 180 degrees centigrade for one hour. i: At 23 degrees centigrade, the loss tangent at a measurement frequency of 10 GHz is less than or equal to 0.005. ii: At 23 degrees centigrade, the loss tangent at a measurement frequency of 20 GHz is less than or equal to 0.007. iii: At 23 degrees centigrade, the loss tangent at a measurement frequency of 40 GHz is less than or equal to 0.01. iv: When the mass reduction rate measured in compliance...
