To provide a resin composition capable of providing a well-balanced cured product which is excellent in thin film insulation properties even when an inorganic filler with a small average particle size is used, and can maintain adhesion between the cured product and a conductor layer after an environmental test under high temperature and high humidity environment.SOLUTION: The resin composition contains (A) an epoxy resin, (B) a benzoxazine compound, and (C) inorganic filler having an average particle size of 100 nm or less where, when a non-volatile component in the resin composition is assumed to be 100 mass percent, a content of the component (C) is 40 mass percent or more.SELECTED DRAWING: None

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