PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in insulation reliability and has a low coefficient of linear thermal expansion and in which the occurrence of warpage is suppressed; and a resin sheet, a circuit board and a semiconductor chip package each using the same.SOLUTION: The resin composition is provided that contains: an elastomer (a); a liquid epoxy resin (b1) having an aromatic structure; a solid epoxy resin (b2) having an aromatic structure; and an inorganic filler (c), the content of the component (c) being 50-95 mass percent when a nonvolatile component of the resin composition is 100 mass percent. In a cured product obtained by heat-curing the resin composition at 180 degrees centigrade for 1 hour, a coefficient of elasticity at 23 degrees centigrade is 18 GPa or less, a relative dielectric constant at 23 degrees centigrade and a measuring frequency of 5.8 GHz is...

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