To provide a resin composition that makes it possible to obtain an insulating layer having high adhesion to a conductor layer after an HAST test, and has a low melt viscosity; a resin sheet containing the resin composition; and a printed wiring board having an insulating layer formed with the resin composition, and a semiconductor device.SOLUTION: A resin composition contains (A) an epoxy resin, and (B) a resin composition containing a maleimide compound, the (B) component having at least one of an alkyl group with 5 or more carbon atoms and an alkylene group with 5 or more carbon atoms.SELECTED DRAWING: None

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