A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt percent to 40 wt percent of a liquid rubber, 20 wt percent to 70 wt percent of a polyphenylene ether resin, 5 wt percent to 30 wt percent of a bismaleimide resin, and 20 wt percent to 45 wt percent of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.
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