The resin sheet for sealing and the electronic component device

Provided are a resin sheet for sealing an electronic component chip mounted on a substrate in a state of facing the substrate via a gap, the resin sheet being suitable for achieving both high heat dissipation and good hollow sealing performance, and an electronic component device. The sealing resin sheet X of the present invention includes a sealing resin layer 11 and a sealing resin layer 12 in order in a thickness direction H. The sealing resin layer 11 contains a first thermosetting resin, a layered silicate compound, and a first inorganic filler other than the layered silicate compound. The sealing resin layer 12 contains a second thermosetting resin and a second inorganic filler. The sealing resin sheet X has a thermal conductivity of 2 W/m.K or more after curing. An electronic component device Y of the present invention includes a substrate S, an electronic component chip 21 mounted on...