The present invention enables the achievement of: a fluororesin film which is reduced in defects during lamination, while exhibiting good adhesion to a copper foil; and a copper-clad laminate which uses this fluororesin film. A fluororesin film which is formed from a composition containing fluorine, wherein: if the surface state of one surface or both surfaces thereof is determined by a scanning-type X-ray photoelectron spectrometer (XPS/ESCA) after being subjected to a heat treatment at 180 degrees centigrade for 3 minutes, the oxygen element ratio is 1.35 atomic percent or more; and if the film is subjected to a heat treatment at 180 degrees centigrade for 10 minutes and is subsequently cooled to room temperature, the absolute values of respective dimensional change rates in MD and TD before and after the heat treatment are 2 percent or less.

Keywords
METALS SHAPE RESINS STRUCTURE
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