To provide a resin composition having low dielectric properties, and excellent in rust-prevention of a conductor, and adhesion, and suitable for electronic components for 5G communication, and a laminate.SOLUTION: The present invention relates to a resin composition for an insulation film of a high frequency circuit substrate, the resin composition containing following components: (A) resin, (B) a porous compound, and (C) a heterocyclic compound.SELECTED DRAWING: None
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