To provide a resin film laminated material which is used as a plastic substrate and can improve connection reliability by preventing deformation when an electronic component such as an IC is mounted by Thermo-compression bonding through an anisotropic conductive film, and to provide a connection structure and a manufacturing method of the connection structure. A resin film laminate of the present invention includes a first resin film on which electrodes and interconnections are formed, a second resin film that is transparent, an adhesive layer that bonds the first resin film and the second resin film and has an elastic modulus of 100 MPa or more at an ultimate temperature when an electronic component is mounted, And a second flexible member that is disposed between the first flexible member and the second flexible member. Figure 1

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