A thin encapsulating attachment structure, consisting of a first thin film portion, which is provided with two surfaces, wherein one of the surfaces is partially or completely contiguously attached to an attachment portion; and a second thin film portion, which is provided with two surfaces, wherein one of the surfaces is partially or completely contiguously attached to the attachment portion. The attachment portion, which is positioned between the first thin film portion and the second thin film portion, and is a binding agent composed of at least an epoxy resin, a silicone resin, polyester, polyurethane, nano silicate, or a nano titanium, the thickness range of the attachment portion is 0.5˜100 micrometers. The first thin film portion, the attachment portion, and the second thin film portion are assembled to form the thin encapsulating attachment structure, the thickness of which is less than or equal to 200 micrometers.

Keywords
ADHESIVES METALS POLYESTERS POLYURETHANE PHYSICAL PROPERTIES SHAPE ADHESION RESINS STRUCTURE FILLERS
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