To provide an adhesive composition which has high heat resistance and which facilitates removal of an adhesion layer, a laminate produced by using the adhesive composition, a production method of the laminate, and a production method of an electronic component using the adhesive composition.SOLUTION: An adhesive composition is used for forming an adhesion layer to temporarily bond a semiconductor substrate or an electronic device to a support medium, which conducts temporarily bonding by forming a crosslinking structure with heat and curing it, in which the crosslinking structure is decomposed with acid or alkali, and the adhesion layer is removed during a process of decomposition or after the process.SELECTED DRAWING: None

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