ADHESIVE COMPOSITION, LAMINATE, PRODUCTION METHOD OF LAMINATE, AND PRODUCTION METHOD OF ELECTRONIC COMPONENT

To provide an adhesive composition which has high heat resistance and which facilitates removal of an adhesion layer, a laminate produced by using the adhesive composition, a production method of the laminate, and a production method of an electronic component using the adhesive composition.SOLUTION: An adhesive composition is used for forming an adhesion layer to temporarily bond a semiconductor substrate or an electronic device to a support medium, which conducts temporarily bonding by forming a crosslinking structure with heat and curing it, in which the crosslinking structure is decomposed with acid or alkali, and the adhesion layer is removed during a process of decomposition or after the process.SELECTED DRAWING: None