This invention addresses the problem of improving the retention of adhesive strength between the surface of a surface-treated copper material and resin component(s) bonded to said surface after being exposed to a high temperature environment for a long period. The surface-treated copper material has an oxide surface comprising cuprous oxide and copper oxide. For the oxide surface, the sum of the thickness (T1) of the cuprous oxide and the thickness (T2) of the copper oxide determined by sequential electrochemical reduction analysis is 1-40 nm, and the ratio (T2/T1) of the thickness (T2) of the copper oxide to the thickness (T1) of the cuprous oxide is 1-9.
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