Adhesive tape

Provided is an adhesive tape capable of grinding and polishing an upper surface of an adherend such as a substrate or a component with excellent accuracy, and capable of peeling the adhesive tape from the adherend with excellent accuracy after the grinding and polishing. The adhesive tape 100 includes a base material 5 and an adhesive layer 2, and the adhesive layer 2 is formed by applying energy to the base material 5, The adhesive strength to a substrate or component laminated on the adhesive layer 2 is reduced. Before the energy is applied, a complex viscosity ETA* (25 dege density, 1 Hz) measured using a rotational rheometer at a temperature of 25 dege density, a strain amount of 1 mrad and a frequency of 1 Hz is 5.0 x 105 MPa s or more and 9.6 MPa s or less. A complex viscosity ETA* (80 dege Centigrade, 100 Hz)...