To provide a thermosetting resin composition that can achieve a high thermal conductivity and a high heat resistance.SOLUTION: A thermosetting resin composition contains: a bismaleimide compound that does not contain a mesogen group in the molecule and has a conjugated structure with a nitrogen atom of a maleimide group conjugated with an aromatic ring; a curing agent for the bismaleimide compound; and a thermally conductive filler having a thermal conductivity of 20 W/m K or more.SELECTED DRAWING: Figure 1
You do not currently have access to this content.
