The present invention relates to a method of manufacturing a wafer, wherein the wafer has an average thickness between 2 and 6 mm, the wafer is provided on the surface with thickenings in the form of a rib structure, whereby the wafer is obtained by baking a dough comprising at least flour, sugar, eggs, fat, and leavening agent, characterized in that the dough is further provided with at least 2 wt% cookie crumbs, the cookie crumbs being ground, previously baked wafers. The invention also relates to the wafer.

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