The present invention relates to a wafer, wherein the wafer is made from a dough that has been baked in a mould, and wherein the wafer has an average thickness between 2 and 6 mm and wherein the wafer is provided on the surface with thickenings in the form of a rib structure, wherein the dough comprises at least eggs, flour, sugar, fat and leavening agent, wherein at least 65 m% of the dough is flour and sugar, wherein the weight ratio of flour and sugar is comprised between 0.7:1 and 1:1 and the sugar has a grain size between 0.35 and 1.55 mm. The invention also relates to a method for making a wafer.

You do not currently have access to this content.